- N-level packaging
- упаковка N-го уровня
English-Russian electronics dictionary .
N-level packaging
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Packaging Waste Regulations — The Producer Responsibility Obligations (Packaging Waste) Regulations 2007, which originally came into effect at the end of August 1997 in Great Britain and in 1999 in Northern Ireland, was the first producer responsibility legislation in the… … Wikipedia
Embedded Wafer Level Ball Grid Array — Prinzipskizze eWLB Embedded Wafer Level Ball Grid Array (eWLB) ist eine Gehäusebauform für integrierte Schaltungen, bei der die Gehäuseanschlüsse auf einem aus Chips und Vergussmasse künstlich hergestellten Wafer erzeugt werden. Inhaltsverze … Deutsch Wikipedia
Open Packaging Conventions — Not to be confused with Open Packaging Format (OPF), an unrelated format that describes the structure of an EPUB file in XML. Open Packaging Conventions Developed by Microsoft, Ecma, ISO/IEC Initial release December 7, 2006; 4 years… … Wikipedia
Video game packaging — An example of a regular cardbox for a 1998 PC game. It includes the game CD, a catalog and registration card, a promotional leaftlet and the game manual Video game packaging refers to the physical storage of the contents of a computer or video… … Wikipedia
Open Packaging Convention — The Open Packaging Conventions (OPC) is a file packaging format created by Microsoft for storing a combination of XML and non XML files that together form a single entity like an XML Paper Specification (XPS) document in a single compressed file… … Wikipedia
Advanced Packaging Tool — Advanced Packaging Tools apt get requesting confirmation before an installation Stable release 0.8.10[1] / November 30, 2010; 11 months ago … Wikipedia
Movie packaging — In film industry terminology, movie packaging is when a top level talent agency starts up a film or television project using writers, producers, directors and/or actors it represents, before giving other agencies a chance to submit their clients… … Wikipedia
Moisture Sensitivity Level — relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (approximately 30°C/60%RH).… … Wikipedia
Nemotek Technologie — Type Private Industry Semiconductor Founded 2008 Headquarters Morocco … Wikipedia
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… … Wikipedia
